23 research outputs found
" Caractérisation et optimisation des performances RF des interconnexions pour les architectures 3D de circuits intégrés "
National audienc
Extraction de l'impédance caractéristique d'interconnexions
National audienc
"Electrical Characterization and Impact on Signal Integrity of New Basic Interconnection Elements Inside 3D Integrated Circuits",
International audienc
Extraction de l'impédance caractéristique d'interconnexions
National audienc
"Extraction of Equivalent High Frequency Models for TSV and RDL Interconnects Embedded in Stacks of the 3D Integration Technology" Naples, Italy.
International audienc
"Electrical Characterization and Impact on Signal Integrity of New Basic Interconnection Elements Inside 3D Integrated Circuits",
International audienc
"Characteristic Impedance Extraction of Embedded and Integrated Interconnects"
International audienc
Influence of 3D Integration on 2D Interconnections and 2D Self Inductors HF Properties
International audienc
Quality Factor and Frequency Bandwidth of 2D Self Inductors in 3D Integration Stack"
International audienc
"HF Performance Characterization and Prediction of 2D Redistribution Layer Interconnects in a 3D-Integrated Circuit Stack"
International audienc